Comparando MediaTek Dimensity 700 vs MediaTek Dimensity 700

description_compare MediaTek Dimensity 700 and Qualcomm Snapdragon 860

• Name
  MediaTek Dimensity 700 Qualcomm Snapdragon 860
• Segment
  Mobile Mobile
• Family
  Mediatek Dimensity Qualcomm Snapdragon
• Generation
  1 6
• CPU group
  MediaTek Dimensity 700/720/800 Qualcomm Snapdragon 855/860
• Predecessor
  -- Qualcomm Snapdragon 855+

CPU Cores and Base Frequency

• Frequency
  2.00 GHz 1.80 GHz
• CPU Cores
  8 8
• Turbo (1 Core)
  2.20 GHz 2.96 GHz
• CPU Threads
  8 8
• Turbo (8 Cores)
  2.00 GHz 2.42 GHz
• Hyperthreading
  No No
• Overclocking
  No No
• Core architecture
  hybrid (big.LITTLE) hybrid (Prime / big.LITTLE)
• A core
  2x Cortex-A76 1x Kryo 485 Prime
• B core
  6x Cortex-A55 3x Kryo 485 Gold
• C core
  -- 4x Kryo 485 Silver

• GPU name
  ARM Mali-G57 MP2 Qualcomm Adreno 640
• GPU frequency
  0.85 GHz 0.25 GHz
• GPU (Turbo)
  No turbo 0.68 GHz
• Execution units
  2 4
• Shader
  32 384
• Max. GPU Memory
  4 GB 4 GB
• Max. displays
  2 1
• Generation
  Vallhall 1 5
• DirectX Version
  12 12.0
• Technology
  7 nm 7 nm
• Release date
  Q2/2020 Q1/2019

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• AV1
  Decode No
• AVC
  Decode / Encode No
• VC-1
  Decode / Encode No
• JPEG
  Decode / Encode No

• Memory type
  LPDDR4X-2133 LPDDR4X-2133
• Max. Memory
  12 GB 16 GB
• ECC
  No No
• Memory channels
  2 4

• AES-NI
  No No

• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualization
  None None
• L2-Cache
  -- 2.00 MB
• L3-Cache
  -- 3.00 MB
• Architecture
  Cortex-A76 / Cortex-A55 Kryo 485
• Technology
  7 nm 7 nm
• Socket
  N/A N/A
• Release date
  Q1/2021 Q1/2021
• Part Number
  MT6833V/ZA SM8150-AC

• Used in
  Unknown Unknown