AMD Ryzen Embedded R2314
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AMD Ryzen Embedded R2314 - specifiche e benchmark

Overall score
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Released
Q2/2022
AMD Ryzen Embedded R2314

AMD Ryzen Embedded R2314

Sul processore di panoramica AMD Ryzen Embedded R2314, il cui rilascio è avvenuto Q2/2022. Ecco tutte le caratteristiche tecniche e la valutazione delle prestazioni di AMD Ryzen Embedded R2314 nei benchmark. Suggeriamo di esaminare tutti i dati e confrontarli con il modello competitivo. La velocità di clock di base del modello AMD Ryzen Embedded R2314 è 2.10 GHz, tutti i core sono . Il processore supporta DDR4-2666 ed è installato sulla scheda madre su FP5. Il TDP stimato per AMD Ryzen Embedded R2314 è 15 W.
Performance tests
Real tests AMD Ryzen Embedded R2314
Specifications
Complete list of technical specifications
CPU generation and family

description AMD Ryzen Embedded R2314

  • Name
    AMD Ryzen Embedded R2314
  • Family
    AMD Ryzen Embedded R
  • CPU group
    AMD Ryzen Embedded R2000
  • Segment
    Desktop / Server
  • Generation
    2
CPU Cores and Base Frequency

CPU Cores and Base Frequency

  • CPU Cores / Threads
    4 / 4
  • Core architecture
    normal
  • Cores
    4x
  • Hyperthreading / SMT
    No
  • Overclocking
    No
  • Frequency
    2.10 GHz
  • Turbo Frequency (1 Core)
    3.50 GHz
  • Turbo Frequency (4 Cores)
    2.50 GHz
Internal Graphics

  • GPU name
    AMD Radeon Vega 6 Graphics
  • GPU frequency
    1.20 GHz
  • GPU (Turbo)
    No turbo
  • Execution units
    6
  • Shader
    384
  • Max. GPU Memory
    2 GB
  • Max. displays
    3
  • Generation
    8
  • Direct X
    12
  • Technology
    14 nm
  • Release date
    Q1/2018
Hardware codec support

  • h265 / HEVC (8 bit)
    Decode / Encode
  • h265 / HEVC (10 bit)
    Decode / Encode
  • h264
    Decode / Encode
  • VP8
    Decode / Encode
  • VP9
    Decode / Encode
  • AV1
    No
  • AVC
    Decode / Encode
  • VC-1
    Decode
  • JPEG
    Decode / Encode
Memory & PCIe

  • Memory type
    DDR4-2666
  • Max. Memory
    32 GB
  • Memory channels
    2 (Dual Channel)
  • Bandwidth
    42.7 GB/s
  • ECC
    Yes
  • PCIe
    3.0 x 16
  • AES-NI
    Yes
Thermal Management

  • TDP (PL1)
    15 W
  • TDP up
    35 W
  • TDP down
    12 W
  • Tjunction max.
    105 \xc2\xb0C
Technical details

  • Technology
    12 nm
  • Chip design
    Chiplet
  • Socket
    FP5
  • L2-Cache
    2.00 MB
  • L3-Cache
    4.00 MB
  • Architecture
    Zen+
  • Operating systems
    Windows 10, Linux
  • Virtualization
    AMD-V, SVM
  • Instruction set (ISA)
    x86-64 (64 bit)
  • ISA extensions
    SSE4a, SSE4.1, SSE4.2, AVX2, FMA3
  • Release date
    Q2/2022
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