AMD Ryzen Embedded R2314
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AMD Ryzen Embedded R2314 - specifications and benchmarks

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Released
Q2/2022
AMD Ryzen Embedded R2314

AMD Ryzen Embedded R2314

The AMD Ryzen Embedded R2314 technical specifications and performance benchmarks are detailed on this page. The release date is Q2/2022. AMD Ryzen Embedded R2314 supports the installation of FP5 socket on the motherboard. The number of cores is with the base clock speed of 2.10 GHz. Maximum capacity and type of RAM supported are DDR4-2666. TDP is 15 W.
Performance tests
Real tests AMD Ryzen Embedded R2314
Specifications
Complete list of technical specifications
CPU generation and family

description AMD Ryzen Embedded R2314

  • Name
    AMD Ryzen Embedded R2314
  • Family
    AMD Ryzen Embedded R
  • CPU group
    AMD Ryzen Embedded R2000
  • Segment
    Desktop / Server
  • Generation
    2
CPU Cores and Base Frequency

CPU Cores and Base Frequency

  • CPU Cores / Threads
    4 / 4
  • Core architecture
    normal
  • Cores
    4x
  • Hyperthreading / SMT
    No
  • Overclocking
    No
  • Frequency
    2.10 GHz
  • Turbo Frequency (1 Core)
    3.50 GHz
  • Turbo Frequency (4 Cores)
    2.50 GHz
Internal Graphics

  • GPU name
    AMD Radeon Vega 6 Graphics
  • GPU frequency
    1.20 GHz
  • GPU (Turbo)
    No turbo
  • Execution units
    6
  • Shader
    384
  • Max. GPU Memory
    2 GB
  • Max. displays
    3
  • Generation
    8
  • Direct X
    12
  • Technology
    14 nm
  • Release date
    Q1/2018
Hardware codec support

  • h265 / HEVC (8 bit)
    Decode / Encode
  • h265 / HEVC (10 bit)
    Decode / Encode
  • h264
    Decode / Encode
  • VP8
    Decode / Encode
  • VP9
    Decode / Encode
  • AV1
    No
  • AVC
    Decode / Encode
  • VC-1
    Decode
  • JPEG
    Decode / Encode
Memory & PCIe

  • Memory type
    DDR4-2666
  • Max. Memory
    32 GB
  • Memory channels
    2 (Dual Channel)
  • Bandwidth
    42.7 GB/s
  • ECC
    Yes
  • PCIe
    3.0 x 16
  • AES-NI
    Yes
Thermal Management

  • TDP (PL1)
    15 W
  • TDP up
    35 W
  • TDP down
    12 W
  • Tjunction max.
    105 \xc2\xb0C
Technical details

  • Technology
    12 nm
  • Chip design
    Chiplet
  • Socket
    FP5
  • L2-Cache
    2.00 MB
  • L3-Cache
    4.00 MB
  • Architecture
    Zen+
  • Operating systems
    Windows 10, Linux
  • Virtualization
    AMD-V, SVM
  • Instruction set (ISA)
    x86-64 (64 bit)
  • ISA extensions
    SSE4a, SSE4.1, SSE4.2, AVX2, FMA3
  • Release date
    Q2/2022
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