Comparaison entre HiSilicon Kirin 970 et HiSilicon Kirin 970

description_compare Qualcomm Snapdragon 860 and HiSilicon Kirin 970

• Name
  Qualcomm Snapdragon 860 HiSilicon Kirin 970
• Segment
  Mobile Mobile
• Family
  Qualcomm Snapdragon HiSilicon Kirin
• Generation
  6 6
• CPU group
  Qualcomm Snapdragon 855/860 HiSilicon Kirin 970
• Predecessor
  Qualcomm Snapdragon 855+ --

CPU Cores and Base Frequency

• Frequency
  1.80 GHz 1.84 GHz
• CPU Cores
  8 8
• Turbo (1 Core)
  2.96 GHz 2.40 GHz
• CPU Threads
  8 8
• Turbo (8 Cores)
  2.42 GHz 2.40 GHz
• Hyperthreading
  No No
• Overclocking
  No No
• Core architecture
  hybrid (Prime / big.LITTLE) hybrid (big.LITTLE)
• A core
  1x Kryo 485 Prime 4x Cortex-A73
• B core
  3x Kryo 485 Gold 4x Cortex-A53
• C core
  4x Kryo 485 Silver --

• GPU name
  Qualcomm Adreno 640 ARM Mali-G72 MP12
• GPU frequency
  0.25 GHz 0.75 GHz
• GPU (Turbo)
  0.68 GHz No turbo
• Execution units
  4 12
• Shader
  384 192
• Max. GPU Memory
  4 GB 2 GB
• Max. displays
  1 1
• Generation
  5 Bifrost 2
• DirectX Version
  12.0 12
• Technology
  7 nm 16 nm
• Release date
  Q1/2019 Q3/2017

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• AV1
  No No
• AVC
  No Decode / Encode
• VC-1
  No Decode / Encode
• JPEG
  No Decode / Encode

• Memory type
  LPDDR4X-2133 LPDDR4X-2133
• Max. Memory
  16 GB 8 GB
• ECC
  No No
• Memory channels
  4 4

• AES-NI
  No No

• TDP (PL1)
  9 W

• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualization
  None None
• L2-Cache
  2.00 MB --
• L3-Cache
  3.00 MB 2.00 MB
• Architecture
  Kryo 485 Cortex-A73 / Cortex-A53
• Technology
  7 nm 10 nm
• Socket
  N/A N/A
• Release date
  Q1/2021 Q3/2017
• Part Number
  SM8150-AC --

• Used in
  Unknown Huawei Honor 10Huawei Note 10Huawei PlayHuawei Honor View 10Huawei Mate 10 ProHuawei P20Huawei Nova 3Huawei Nova 4