Microsoft XBox Series X
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Microsoft XBox Series X - specifications and benchmarks

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Released
Q3/2020
Microsoft XBox Series X

Microsoft XBox Series X

The Microsoft XBox Series X technical specifications and performance benchmarks are detailed on this page. The release date is Q3/2020. Microsoft XBox Series X supports the installation of BGA socket on the motherboard. The number of cores is with the base clock speed of 3.20 GHz. Maximum capacity and type of RAM supported are GDDR6. TDP is 65 W.
Performance tests
Real tests Microsoft XBox Series X
Cinebench R23 (Single-Core)
Cinebench R23 is the successor of Cinebench R20 and is also based on the Cinema 4 Suite
Specifications
Complete list of technical specifications
CPU generation and family

description Microsoft XBox Series X

  • Name
    Microsoft XBox Series X
  • Family
    AMD Ryzen 7
  • CPU group
    AMD Ryzen 4000G
  • Segment
    Desktop / Server
  • Generation
    3
CPU Cores and Base Frequency

CPU Cores and Base Frequency

  • CPU Cores / Threads
    8 / 16
  • Core architecture
    normal
  • Cores
    8x Zen 2
  • Hyperthreading / SMT
    Yes
  • Overclocking
    No
  • Frequency
    3.20 GHz
  • Turbo Frequency (1 Core)
    3.80 GHz
  • Turbo Frequency (8 Cores)
    3.66 GHz
Internal Graphics

  • GPU name
    AMD Custom Radeon Graphics (XBox Series X)
  • GPU frequency
    1.83 GHz
  • GPU (Turbo)
    No turbo
  • Execution units
    52
  • Shader
    3328
  • Max. GPU Memory
    10 GB
  • Max. displays
    1
  • Generation
    1
  • Direct X
    12
  • Technology
    7 nm
  • Release date
    Q3/2021
Hardware codec support

  • h265 / HEVC (8 bit)
    Decode / Encode
  • h265 / HEVC (10 bit)
    Decode / Encode
  • h264
    Decode / Encode
  • VP8
    Decode / Encode
  • VP9
    Decode / Encode
  • AV1
    No
  • AVC
    Decode / Encode
  • VC-1
    Decode
  • JPEG
    Decode / Encode
Memory & PCIe

  • Memory type
    GDDR6
  • Max. Memory
    16 GB
  • Memory channels
    2 (Dual Channel)
  • Bandwidth
    560.0 GB/s
  • ECC
    No
  • PCIe
    4.0 x 12
  • AES-NI
    Yes
Thermal Management

  • TDP (PL1)
    65 W
  • Tjunction max.
    100 \xc2\xb0C
Technical details

  • Technology
    7 nm
  • Chip design
    Chiplet
  • Socket
    BGA
  • L3-Cache
    8.00 MB
  • Architecture
    Renoir (Zen 2)
  • Operating systems
    Windows 10, Windows 11, Linux
  • Virtualization
    AMD-V, SVM
  • Instruction set (ISA)
    x86-64 (64 bit)
  • ISA extensions
    SSE4a, SSE4.1, SSE4.2, AVX2, FMA3
  • Release date
    Q3/2020
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Microsoft XBox Series X
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